JEDEC atjaunina modernu augstas joslas atmiņas (HBM) standartu



JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard. HBM DRAM is used in Graphics, High Performance Computing, Server, Networking and Client applications where peak bandwidth, bandwidth per watt, and capacity per area are valued metrics to a solution's success in the market. The standard was developed and updated with support from leading GPU and CPU developers to extend the system bandwidth growth curve beyond levels supported by traditional discrete packaged memory. JESD235B is available for download from the JEDEC website.

JEDEC standarts JESD235B HBM izmanto plaša I / O un TSV tehnoloģijas, lai atbalstītu blīvumu līdz 24 GB vienai ierīcei ar ātrumu līdz 307 GB / s. Šis joslas platums tiek piegādāts pa 1024 bitu plašu ierīces saskarni, kas ir sadalīta 8 neatkarīgos kanālos katrā DRAM kaudzī. Standarts var atbalstīt 2-augstas, 4-augstas, 8-augstas un 12 augstas DRV kaudzes DRAM ar pilnu joslas platumu, lai ļautu sistēmām elastīgi izmantot jaudas prasības no 1 GB līdz 24 GB uz kaudzīti.

This update extends the per pin bandwidth to 2.4 Gbps, adds a new footprint option to accommodate the 16 Gb-layer and 12-high configurations for higher density components, and updates the MISR polynomial options for these new configurations. Additional clarifications are provided throughout the document to address test features and compatibility across generations of HBM components.