TSMC ceļā uz 3 nm piegādi 2022. gadā



TSMC is delivering record results day after day, with a 5 nm manufacturing process starting High Volume Manufacturing (HVM) in Q2 next year, 7 nm process getting plenty of orders and the fact that TSMC just became the biggest company publicly trading in Asia. Continuing with the goal to match or even beat the famous Moore's Law, TSMC is already planning for future 3 nm node manufacturing, promised to start HVM as soon as 2022 arrives, according to JK Wang, TSMC's senior vice president of fab operations. Delivering 3 nm a whole year before originally planned in 2023, TSMC is working hard, with fab construction work doing quite well, judging by all the news that the company is releasing recently.

Mēs varam cerēt redzēt pirmo produktu vilni, kas izgatavoti, izmantojot 3 nm ražošanas procesu, kaut kad ap 2022. gada beigām, kad pienāks svētku laiks. Parasti klienti, piemēram, Apple un HiSilicon, noteikti izmantos jauno mezglu un piegādās savus viedtālruņus ar 3 nm procesoriem iekšā, tiklīdz process būs gatavs HVM.
Source: DigiTimes